例句與造句

1. When the concentration of cosc > 4 was 30g / l , the plating rate was max
   絡(luò)合劑在濃度較低時(shí)對(duì)化學(xué)鍍有加速作用，濃度太高反而會(huì)延緩鍍速。
2. All the factors studied had an effect on plating rate , i . e . , weight gain per unit of time
   這些因素通過影響化學(xué)鍍反應(yīng)時(shí)間和粉末增重而影響鍍速。
3. However , when the concentration of them was enough higher , the in if . plating rate was decreasing
   鍍液ph值升高，鍍層磷含量減少，形成非晶鍍層的趨勢(shì)增大。
4. Plating rate was determined by measuring the weight gain of powder after plating , and the ingredients of solution were determined by chemical analysis
   鍍速用增重法，鍍液成分用化學(xué)滴定法確定。
5. The experiments showed that these factors could increase the plating rate which the concentration of nah2 ? o2 " t ^ o , the ph and the temperature of electroless plating had been risen
   實(shí)驗(yàn)表明：鍍液ph值和施鍍溫度升高，次亞磷酸鈉和緩沖劑濃度增加，鍍速提高。
6. It's difficult to find plating rate in a sentence. 用plating rate造句挺難的
7. The results showed that the factors that could shorten the plating time increased the plating rate . the plating rate was increased when the ph and the temperature of the bath were increased . it was also increased by increasing the concentration of copper sulfate and by decreasing the concentration of edta
   結(jié)果表明，鍍液出值和施鍍溫度升高，鍍速提高：提高硫酸銅濃度，可以增加鍍速； nm濃度提高，鍍液穩(wěn)定性增加，鍍速下降：隨甲醛濃度的提高，鍍這光增加而后下降。
8. When the bath load was increased , the plating rate was shortened . the effects of bath composition and plating conditions on the composition were also investigated . the x - ray analysis showed that edta and the stabilization agent can effectively increase the content of the copper oxidation in the composite powders
   粉體x ray分析的結(jié)果表明，絡(luò)合劑對(duì)防止鍍液中的氫氧化銅的產(chǎn)生起來關(guān)鍵作用，而氫氧化鋼是產(chǎn)生氧化亞銅的直接原因，因而選用edta作為絡(luò)合劑，以及合適的量，可以減少二射線中的氧化亞銅的饅頭峰。